AI Technology

Specialty Adhesives, Coatings, TIMs Materials for Ultimate Device Reliability

Ultra-High Thermally Conductive Interfaces for Efficient LED Lighting

LED DIE-ATTACH:
• Hyper-Conductive Epoxies
• Insulating Thermal Adhesives

SUB-MODULE MOUNTING
• Pressure-Sensitive Film Adhesives
• Compressible Phase Change Pads

MODULE-TO-HEATSINK INTERFACE
• Pressure-Sensitive Film Adhesives
• Compressible Phase Change Pads
• Thermal Greases & Gels

Superior Thermal Performance

COOL-BOND®: High-Performance Thermal Adhesives

COOL-GREASE®: Industry Proven Thermal Grease

COOL-GEL® In-Situ Curing Thermal Gel

COOL-PAD™ Compressible and Gap Filling Pads

COOL-CLAD™ IMTS

COOL-PREG™ Low Pressure Rapid Curing Laminat

Cooling Your Laptop, Smartphone, and PC for the Highest Performance
	• CPU to Heatsink • Compressible Phase Change Pads • Thermal Greases & Gels • Pressure Sensitive Film Adhesives • Compressible Phase Change Pads • Thermal Greases & Gels • Memory Module to Heatspreader • Pressure Sensitive Thermal Pads • Compressible Thermal Pads • Components to Casting Heatsink • Compressible Gap Filling Pad

Adhesives for Ultimate Device Reliablility
	High Concuctivity • Films & Pates • High Temperature • Flexible & Compliant • Thermal Interface Materials • Compressible Gap-Pad Films • Compressible Phase Change Pads • Greases & Gels • Thin Bondline
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